Repair Equipment - Company Ranking(9 companies in total)
Last Updated： Aggregation Period:Nov 05, 2025〜Dec 02, 2025
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| ■Basic Specifications - Supported wafer sizes: 8, 12 inch wafers - Supported ball diameters: φ50μm to φ300μm - Minimum ball pitch: 90μ... | Supports a wide range of packages including generative AI, data centers, automotive chips, MEMS, communication modules, photonic ICs, and an... | ||
| ■Basic Specifications - Supported board size: 60×100 to 260×300 mm - Supported ball diameter: Φ50μm to φ300μm - Minimum ball pitch: 90... | Support for large and advanced packages for generative AI and data centers. *For more details, please refer to the PDF document or feel fr... | ||
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日精 本社
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- Featured Products
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Wafer-Compatible Micro Ball Inspection Repair System BM-1150WR
- overview
- ■Basic Specifications - Supported wafer sizes: 8, 12 inch wafers - Supported ball diameters: φ50μm to φ300μm - Minimum ball pitch: 90μ...
- Application/Performance example
- Supports a wide range of packages including generative AI, data centers, automotive chips, MEMS, communication modules, photonic ICs, and an...
Micro Ball Inspection Repair System for Substrates BM-2150SR
- overview
- ■Basic Specifications - Supported board size: 60×100 to 260×300 mm - Supported ball diameter: Φ50μm to φ300μm - Minimum ball pitch: 90...
- Application/Performance example
- Support for large and advanced packages for generative AI and data centers. *For more details, please refer to the PDF document or feel fr...
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日精 本社
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